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H5TQ1G63BFR-12C

Name: H5TQ1G63BFR-12C
Rating: 4.5 (10 reviews)

High-speed CMOS technology

ブランド: SKHYNIX

製造元部品 #: H5TQ1G63BFR-12C

データシート: H5TQ1G63BFR-12C データシート (PDF)

パッケージ/ケース: BGA-96

製品の種類: メモリ

RoHS ステータス:

在庫状況: 7,797 個、新しいオリジナル

Warranty: 1 Year Ovaga Warranty - Find Out More

簡単な見積もり

RFQを提出してください H5TQ1G63BFR-12C またはメールでご連絡ください: メール: [email protected], 12時間以内にご連絡させていただきます。

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H5TQ1G63BFR-12C 概要

DescriptionThe H5TQ2G43CFR-xxC, H5TQ2G83CFR-xxC are a 2,147,483,648-bit CMOS Double Data Rate III (DDR3) Synchronous DRAM, ideally suited for the main memory applications which requires large memory density and high bandwidth. SK hynix 2Gb DDR3 SDRAMs offer fully synchronous operations referenced to both rising and falling edges of the clock. While all addresses and control inputs are latched on the rising edges of the CK (falling edges of the CK), Data, Data strobes and Write data masks inputs are sampled on both rising and falling edges of it. The data paths are internally pipelined and 8-bit prefetched to achieve very high bandwidth.FEATURES• VDD=VDDQ=1.5V +/- 0.075V• Fully differential clock inputs (CK, CK) operation• Differential Data Strobe (DQS, DQS)• On chip DLL align DQ, DQS and DQS transition with CK  transition• DM masks write data-in at the both rising and falling  edges of the data strobe• All addresses and control inputs except data,  data strobes and data masks latched on the  rising edges of the clock• Programmable CAS latency 5, 6, 7, 8, 9, 10, 11, 12, 13 and 14 supported• Programmable additive latency 0, CL-1, and CL-2  supported• Programmable CAS Write latency (CWL) = 5, 6, 7, 8, 9, 10• Programmable burst length 4/8 with both nibble  sequential and interleave mode• BL switch on the fly• 8banks• Average Refresh Cycle (Tcase of0 oC~ 95oC) - 7.8 µs at 0oC ~ 85 oC - 3.9 µs at 85oC ~ 95 oC• JEDEC standard 78ball FBGA(x4/x8)• Driver strength selected by EMRS• Dynamic On Die Termination supported• Asynchronous RESET pin supported• ZQ calibration supported• TDQS (Termination Data Strobe) supported (x8 only)• Write Levelization supported• 8 bit pre-fetch• This product in compliance with the RoHS directive.

特徴

VDD=VDDQ=1.5V +/- 0.075V
Fully differential clock inputs (CK, CK) operation
Differential Data Strobe (DQS, DQS)
On chip DLL align DQ, DQS and DQS transition with CK 
transition
DM masks write data-in at the both rising and falling 
edges of the data strobe
All addresses and control inputs except data, 
data strobes and data masks latched on the 
rising edges of the clock
Programmable CAS latency 5, 6, 7, 8, 9, 10, 11, 12, 13
and 14 supported
Programmable additive latency 0, CL-1, and CL-2 
supported
Programmable CAS Write latency (CWL) = 5, 6, 7, 8, 9, 10
Programmable burst length 4/8 with both nibble 
sequential and interleave mode
BL switch on the fly
8banks
Average Refresh Cycle (Tcase of0 oC~ 95oC)
- 7.8 µs at 0oC ~ 85 oC
- 3.9 µs at 85oC ~ 95 oC
JEDEC standard 78ball FBGA(x4/x8)
Driver strength selected by EMRS
Dynamic On Die Termination supported
Asynchronous RESET pin supported
ZQ calibration supported
TDQS (Termination Data Strobe) supported (x8 only)
Write Levelization supported
8 bit pre-fetch
This product in compliance with the RoHS directive.

応用

Main memory for mobile devices, such as smartphones and tablets
Graphics processing units (GPUs) in gaming consoles and high-performance computing systems
Digital cameras and camcorders for storing images and videos
Network routers and switches for packet buffering and forwarding
Embedded systems and Internet of Things (IoT) devices requiring fast and reliable memory access
Industrial applications for data logging and processing

仕様

パラメータ	価値	パラメータ	価値
Product Name	H5TQ1G63BFR-12C	Product Type	Memory
Manufacturer	Hynix	Memory Type	DDR3 SDRAM
Capacity	1GB	Interface	Parallel
Clock Frequency	533MHz	Operating Voltage	1.5V
Temperature Range	-40°C ~ 85°C	Mounting Type	Surface Mount
Package / Case	FBGA-84

配送

	配送料	リードタイム
DHL	$20.00-$40.00 (0.50 KG)	2-5 日々
フェデックス	$20.00-$40.00 (0.50 KG)	2-5 日々
UPS	$20.00-$40.00 (0.50 KG)	2-5 日々
TNT	$20.00-$40.00 (0.50 KG)	2-5 日々
EMS	$20.00-$40.00 (0.50 KG)	2-5 日々
登録された航空便	$20.00-$40.00 (0.50 KG)	2-5 日々

処理時間：送料は地域や国によって異なります。

支払い

支払条件		ハンドフィー
	電信送金	銀行手数料 US$30.00 を請求します。
	ペイパル	4.0％のサービス料がかかります。
	クレジットカード	3.5％のサービス料がかかります。
	ウエスタンユニオン	charge US.00 banking fee.
	送金サービス	銀行手数料は 0.00 米ドルかかります。

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パーツポイント

The H5TQ1G63BFR-12C chip is a type of synchronous dynamic random-access memory (SDRAM) used in electronic devices such as smartphones and tablets. It offers a capacity of 1 Gbit and operates at a clock speed of 667 MHz. The chip incorporates multiple memory banks and supports a burst mode for improved data transfer rates. It is commonly used as a main memory in consumer electronics due to its high performance and reliability.
Equivalent

The equivalent products of the H5TQ1G63BFR-12C chip are the H5TQ1G63BFR-12C and other related DDR3 SDRAM chips.
Features

H5TQ1G63BFR-12C is a type of dynamic random-access memory (DRAM) chip with a capacity of 1 gigabit. It operates at a frequency of 800 MHz and has a data transfer rate of 1.6 gigabytes per second. It is designed for use in various electronic devices such as smartphones, tablets, and other mobile devices.
Pinout

The H5TQ1G63BFR-12C is a memory chip with a pin count of 78. It is a 1Gb LPDDR2 SDRAM chip used in mobile devices and offers high-speed data transfer rates.
Manufacturer

The manufacturer of the H5TQ1G63BFR-12C is SK Hynix. SK Hynix is a South Korean semiconductor manufacturing company that specializes in the production of memory chips, including DRAM (Dynamic Random Access Memory) and NAND flash. They are known for their high-quality memory solutions, used in various electronic devices such as smartphones, computers, and servers.
Application Field

The H5TQ1G63BFR-12C is a type of synchronous dynamic random-access memory (SDRAM) chip commonly used in mobile devices such as smartphones and tablets. It provides high-speed data storage and retrieval for applications such as gaming, multimedia playback, and multitasking.
Package

The H5TQ1G63BFR-12C chip comes in a BGA package type with a form factor of FBGA and a size of 9mm x 11mm.