注文金額が
$5000
RC28F00AP30TFA
EASYBGA-64(8x10) NOR flash memory module with 64 pins, designed for RoHS compliance and easy installation
![ISO14001](/img/about/iso14001.png)
![ISO9001](/img/about/iso9001.png)
![DUNS](/img/about/duns.png)
ブランド: MICRON TECHNOLOGY INC
製造元部品 #: RC28F00AP30TFA
データシート: RC28F00AP30TFA データシート (PDF)
パッケージ/ケース: 64-EasyBGA (8x10)
RoHS ステータス:
在庫状況: 6,554 個、新しいオリジナル
製品の種類: メモリ
Warranty: 1 Year Ovaga Warranty - Find Out More
0
1
*すべての価格は米ドルです
数量 | 単価 | 外部価格 |
---|---|---|
1 | $30.760 | $30.760 |
200 | $12.274 | $2454.800 |
500 | $11.863 | $5931.500 |
1000 | $11.661 | $11661.000 |
在庫あり: 6,554 PCS
RC28F00AP30TFA 概要
Distinguished by its sector architecture, the RC28F00AP30TFA facilitates flexible block erasure, accommodating both uniform and non-uniform block sizes with ease. Its prowess extends to performance, offering rapid read and write speeds that are paramount for applications necessitating prompt data access
特徴
- Architecture
- — Symmetrical 128-Kbyte blocks
- — 256 Mbit (256 blocks)
- — 128 Mbit (128 blocks)
- — 64 Mbit (64 blocks)
- — 32 Mbit (32 blocks)
- Performance
- — 75 ns Initial Access Speed (32,64,128 Mbit densities)
- — 95 ns Initial Access Speed (256Mbit only)
- — 25 ns 8-word and 4-word Asynchronous page-mode reads
- — 32-Byte Write buffer; 4 µs per Byte Effective programming time
- System Voltage
- — VCC = 2.7 V to 3.6 V
- — VCCQ = 2.7 V to 3.6 V
- Packaging
- — 56-Lead TSOP (32, 64, 128, 256 Mbit)
- — 64-Ball Numonyx Easy BGA package (32, 64, 128 and 256 Mbit)
- Security
- — Enhanced security options for code protection
- — 128-bit Protection Register: 64-bits Unique device identifier bits 64-bits User-programmable OTP bits
- — Absolute protection with VPEN = GND
- — Individual block locking
- — Block erase/program lockout during power transitions
- Software
- — Program and erase suspend support
- — Flash Data Integrator (FDI), Common Flash Interface (CFI) Compatible
- Quality and Reliability
- — Operating temperature: -40 °C to +85 °C
- — 100K Minimum erase cycles per block
- — 0.13 µm ETOX™ VIII Process technology
仕様
パラメータ | 価値 | パラメータ | 価値 |
---|---|---|---|
Pbfree Code | No | Rohs Code | No |
Part Life Cycle Code | Obsolete | Ihs Manufacturer | MICRON TECHNOLOGY INC |
Part Package Code | BGA | Package Description | BGA-64 |
Pin Count | 64 | Reach Compliance Code | |
ECCN Code | EAR99 | HTS Code | 8542.32.00.51 |
Access Time-Max | 100 ns | Additional Feature | TOP BOOT |
Boot Block | TOP | Command User Interface | YES |
Common Flash Interface | YES | Data Polling | NO |
JESD-30 Code | R-PBGA-B64 | JESD-609 Code | e1 |
Length | 10 mm | Memory Density | 1073741824 bit |
Memory IC Type | FLASH | Memory Width | 16 |
Number of Functions | 1 | Number of Sectors/Size | 4,1023 |
Number of Terminals | 64 | Number of Words | 67108864 words |
Number of Words Code | 64000000 | Operating Mode | SYNCHRONOUS |
Operating Temperature-Max | 85 °C | Operating Temperature-Min | -40 °C |
Organization | 64MX16 | Package Body Material | PLASTIC/EPOXY |
Package Code | TBGA | Package Equivalence Code | BGA64,8X8,40 |
Package Shape | RECTANGULAR | Package Style | GRID ARRAY, THIN PROFILE |
Page Size | 16 words | Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Cel) | 235 | Power Supplies | 1.8,1.8/3.3 V |
Programming Voltage | 3 V | Qualification Status | Not Qualified |
Seated Height-Max | 1.2 mm | Sector Size | 16K,64K |
Standby Current-Max | 0.00024 A | Supply Current-Max | 0.031 mA |
Supply Voltage-Max (Vsup) | 2 V | Supply Voltage-Min (Vsup) | 1.7 V |
Supply Voltage-Nom (Vsup) | 1.8 V | Surface Mount | YES |
Technology | CMOS | Temperature Grade | INDUSTRIAL |
Terminal Finish | TIN SILVER COPPER | Terminal Form | BALL |
Terminal Pitch | 1 mm | Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | 30 | Toggle Bit | NO |
Type | NOR TYPE |
配送
配送タイプ | 配送料 | リードタイム | |
---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 日々 |
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フェデックス | $20.00-$40.00 (0.50 KG) | 2-5 日々 |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 日々 |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 日々 |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 日々 |
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登録された航空便 | $20.00-$40.00 (0.50 KG) | 2-5 日々 |
処理時間:送料は地域や国によって異なります。
支払い
支払条件 | ハンドフィー | |
---|---|---|
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電信送金 | 銀行手数料 US$30.00 を請求します。 |
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ペイパル | 4.0%のサービス料がかかります。 |
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クレジットカード | 3.5%のサービス料がかかります。 |
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ウエスタンユニオン | charge US.00 banking fee. |
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送金サービス | 銀行手数料は 0.00 米ドルかかります。 |
保証
1.購入した電子部品には365日保証が含まれており、製品の品質を保証します。
2.受け取った商品の一部が完璧な品質ではない場合、当社は責任を持って返金または交換を手配します。 ただし、商品は元の状態のままでなければなりません。
パッキング
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ステップ1 :製品
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ステップ2 :真空包装
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ステップ3 :静電気防止袋
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ステップ4 :個包装
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ステップ5 :梱包箱
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ステップ6 :バーコード配送タグ
すべての製品は静電気防止袋に梱包されます。 ESD 帯電防止保護を備えた状態で出荷されます。
社外の ESD 梱包ラベルには、部品番号、ブランド、数量などの当社の情報が使用されます。
私たちは出荷前にすべての商品を検査し、すべての製品が良好な状態であることを確認し、部品が新しいオリジナルでデータシートと一致していることを確認します。
すべての商品に問題がないことを確認した後、梱包後、安全に梱包し、グローバルエクスプレスで発送します。 優れた耐穿刺性と耐引裂性を示し、シールの完全性も良好です。
パーツポイント
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The RC28F00AP30TFA chip is a flash memory chip manufactured by Intel. It offers 3V operation with a capacity of 128Mb to meet various storage needs. The chip also features a fast read and program speed, making it suitable for applications requiring high performance and reliability.
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Equivalent
The equivalent products of the RC28F00AP30TFA chip are the Intel 28F008SA, 28F008B3T, and 28F008S5 chips. These are all high-performance 3V Flash Memory chips with similar specifications and features. -
Features
- 32MB Flash Memory - x16 Interface - 3V Supply Voltage - 100ns Access Time - Industrial Temperature Range (-40°C to 85°C) - Low Power Consumption - ETOPIA Architecture - Hardware-Based Asynchronous Reset - Advanced Command Set and Lock Register - Lockable Boot Block - Extended Block Erase Times - 100,000 Erase/Write Cycles. -
Pinout
The RC28F00AP30TFA is a 44-pin BGA flash memory chip produced by Intel. It functions as a 32Mb (4MB) Parallel NOR Flash Memory. -
Manufacturer
The manufacturer of the RC28F00AP30TFA is Intel Corporation. Intel Corporation is an American multinational technology company that designs and manufactures semiconductor chips and other technologies used in computers and electronic devices. They are one of the world's largest and highest-valued semiconductor chip makers. -
Application Field
The RC28F00AP30TFA is commonly used in automotive, industrial, and consumer electronics applications that require high-performance, low-power, and high-density flash memory storage solutions. It is suitable for applications such as infotainment systems, navigation systems, industrial control systems, and smart home devices. -
Package
The RC28F00AP30TFA chip is a BGA (Ball Grid Array) package type, with a size of 10 x 18 mm, and a total of 100 balls. It is a Flash Memory chip in a compact and soldered form factor suitable for various electronic devices.
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