注文金額が
$5000ST NAND512R3A2DZA6E
High-performance storage solution for demanding application
![ISO14001](/img/about/iso14001.png)
![ISO9001](/img/about/iso9001.png)
![DUNS](/img/about/duns.png)
ブランド: STMicroelectronics, Inc
製造元部品 #: NAND512R3A2DZA6E
データシート: NAND512R3A2DZA6E Datasheet (PDF)
パッケージ/ケース: BGA-63
製品の種類: メモリ
NAND512R3A2DZA6E 概要
The NAND512R3A2DZA6E from Micron Technology is a powerful NAND Flash memory device with a capacity of 512 megabytes. It operates on a 3.3 volt power supply and is designed with memory blocks and pages for efficient data storage. With a synchronous interface and a maximum clock frequency of 50 MHz, this device offers lightning-fast data transfer speeds. Its support for features such as random read/write operations, hardware data protection, and error correction codes ensures the integrity of stored data. This makes it an ideal choice for solid-state drives, smartphones, tablets, and other consumer electronics devices where high-density storage and low power consumption are critical. The NAND512R3A2DZA6E is built for reliable performance and durability, making it suitable for use in high-demand environments
![nand512r3a2dza6e nand512r3a2dza6e](/files/uploads/product/b/nand512r3a2dza6e20161220115026_2090.jpg)
特徴
- It has a storage capacity of 512 megabytes (MB).
- It uses a NAND flash memory architecture, which allows for fast read and write speeds.
- It uses a 3.3 volt power supply.
- It has a small form factor and is surface-mountable.
- It has a maximum operating temperature range of -40°C to 85°C.
応用
- S34ML04G200TFI000 from Cypress Semiconductor
- MT29F512G08CKCABH6-IT from Micron Technology
- K9GBG08U0M-PCB0 from Samsung Electronics
仕様
パラメータ | 価値 | パラメータ | 価値 |
---|---|---|---|
Rohs Code | Yes | Part Life Cycle Code | Obsolete |
Ihs Manufacturer | MICRON TECHNOLOGY INC | Part Package Code | BGA |
Package Description | 9 X 11 MM, 1.05 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-63 | Pin Count | 63 |
Reach Compliance Code | ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | Samacsys Manufacturer | Micron |
Access Time-Max | 15000 ns | Command User Interface | YES |
Data Polling | NO | JESD-30 Code | R-PBGA-B63 |
JESD-609 Code | e1 | Length | 11 mm |
Memory Density | 536870912 bit | Memory IC Type | FLASH |
Memory Width | 8 | Number of Functions | 1 |
Number of Sectors/Size | 4K | Number of Terminals | 63 |
Number of Words | 67108864 words | Number of Words Code | 64000000 |
Operating Mode | ASYNCHRONOUS | Operating Temperature-Max | 85 °C |
Operating Temperature-Min | -40 °C | Organization | 64MX8 |
Package Body Material | PLASTIC/EPOXY | Package Code | TFBGA |
Package Equivalence Code | BGA63,10X12,32 | Package Shape | RECTANGULAR |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | Page Size | 512 words |
Parallel/Serial | PARALLEL | Peak Reflow Temperature (Cel) | 260 |
Programming Voltage | 1.8 V | Qualification Status | Not Qualified |
Ready/Busy | YES | Seated Height-Max | 1.05 mm |
Sector Size | 16K | Standby Current-Max | 0.00005 A |
Supply Current-Max | 0.02 mA | Supply Voltage-Max (Vsup) | 1.95 V |
Supply Voltage-Min (Vsup) | 1.7 V | Supply Voltage-Nom (Vsup) | 1.8 V |
Surface Mount | YES | Technology | CMOS |
Temperature Grade | INDUSTRIAL | Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal Form | BALL | Terminal Pitch | 0.8 mm |
Terminal Position | BOTTOM | Time@Peak Reflow Temperature-Max (s) | 30 |
Toggle Bit | NO | Type | SLC NAND TYPE |
Width | 9 mm |
配送
配送タイプ | 配送料 | リードタイム | |
---|---|---|---|
![]() |
DHL | $20.00-$40.00 (0.50 KG) | 2-5 日々 |
![]() |
フェデックス | $20.00-$40.00 (0.50 KG) | 2-5 日々 |
![]() |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 日々 |
![]() |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 日々 |
![]() |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 日々 |
![]() |
登録された航空便 | $20.00-$40.00 (0.50 KG) | 2-5 日々 |
処理時間:送料は地域や国によって異なります。
支払い
支払条件 | ハンドフィー | |
---|---|---|
![]() |
電信送金 | 銀行手数料 US$30.00 を請求します。 |
![]() |
ペイパル | 4.0%のサービス料がかかります。 |
![]() |
クレジットカード | 3.5%のサービス料がかかります。 |
![]() |
ウエスタンユニオン | charge US.00 banking fee. |
![]() |
送金サービス | 銀行手数料は 0.00 米ドルかかります。 |
保証
1.購入した電子部品には365日保証が含まれており、製品の品質を保証します。
2.受け取った商品の一部が完璧な品質ではない場合、当社は責任を持って返金または交換を手配します。 ただし、商品は元の状態のままでなければなりません。
パッキング
-
ステップ1 :製品
-
ステップ2 :真空包装
-
ステップ3 :静電気防止袋
-
ステップ4 :個包装
-
ステップ5 :梱包箱
-
ステップ6 :バーコード配送タグ
すべての製品は静電気防止袋に梱包されます。 ESD 帯電防止保護を備えた状態で出荷されます。
社外の ESD 梱包ラベルには、部品番号、ブランド、数量などの当社の情報が使用されます。
私たちは出荷前にすべての商品を検査し、すべての製品が良好な状態であることを確認し、部品が新しいオリジナルでデータシートと一致していることを確認します。
すべての商品に問題がないことを確認した後、梱包後、安全に梱包し、グローバルエクスプレスで発送します。 優れた耐穿刺性と耐引裂性を示し、シールの完全性も良好です。
パーツポイント
-
The NAND512R3A2DZA6E chip is a 512Mb NAND flash memory device that is commonly used in products such as smartphones, tablets, and other electronic devices. It offers high storage capacity with fast read and write speeds, making it ideal for applications that require large amounts of data storage.
-
Equivalent
The equivalent products of NAND512R3A2DZA6E chip are MT29F512G08CMCABH5-6IT, K9F5608U0D-J, IS42S16320F-7TLI, and W25N05JVA6. -
Features
NAND512R3A2DZA6E is a NAND flash memory chip with 512Gb capacity, 3.3V voltage, x8 I/O interface, and A6E package. It features high density storage, fast read/write speeds, and high reliability for a variety of storage applications. -
Pinout
The NAND512R3A2DZA6E is a 48-pin NAND flash memory device with a capacity of 512Mb. It is typically used for data storage in electronic devices. The pin functions include data input/output, address input, control signals, and power supply connections. -
Manufacturer
The manufacturer of the NAND512R3A2DZA6E is Micron Technology, Inc. Micron is a multinational corporation specializing in computer memory and data storage technology. They produce a wide range of products including dynamic random-access memory (DRAM), flash memory, and solid-state drives (SSDs) for various applications in the computer and electronics industry. -
Application Field
The NAND512R3A2DZA6E is commonly used in applications such as solid state drives (SSDs), digital cameras, portable media players, and gaming consoles for data storage and memory expansion. Its high capacity of 512 gigabytes and fast data transfer speeds make it suitable for a wide range of consumer electronics devices. -
Package
The NAND512R3A2DZA6E chip is available in a BGA package type with a form factor of 14x18 mm. It has a capacity of 512 Mb (64 MB) with an organization of 4 banks x 16 M x 8 pages x 2048 bytes.
データシート PDF
私たちは高品質の製品、思いやりのあるサービス、販売後の保証を提供します
-
豊富な商品を取り揃えておりますので、お客様の様々なニーズにお応え致します。
-
最小注文数量は1個からとなります。
-
最低国際配送料は0.00ドルから
-
全商品365日品質保証