JS28F256P30BFE
NOR Flash Parallel 256Mbit 16 56/56
ブランド: MICRON TECHNOLOGY INC
製造元部品 #: JS28F256P30BFE
データシート: JS28F256P30BFE データシート (PDF)
パッケージ/ケース: TSOP-56
製品の種類: NOR Flash
特徴
- High performance
- — 85/88 ns initial access
- — 40 MHz with zero wait states, 20 ns clock-to data output synchronous-burst read mode
- — 25 ns asynchronous-page read mode
- — 4-, 8-, 16-, and continuous-word burst mode
- — Buffered Enhanced Factory Programming (BEFP) at 5 µs/byte (Typ)
- — 1.8 V buffered programming at 7 µs/byte (Typ)
- Architecture
- — Multi-Level Cell Technology: Highest Density at Lowest Cost
- — Asymmetrically-blocked architecture
- — Four 32-KByte parameter blocks: top or bottom configuration
- — 128-KByte main blocks
- Voltage and Power
- —VCC(core) voltage: 1.7 V – 2.0 V
- —VCCQ (I/O) voltage: 1.7 V – 3.6 V
- — Standby current: 55 µA (Typ) for 256-Mbit
- — 4-Word synchronous read current: 13 mA (Typ) at 40 MHz
- Quality and Reliability
- — Operating temperature: –40 °C to +85 °C
- 1-Gbit in SCSP is –30 °C to +85 °C
- — Minimum 100,000 erase cycles per block
- — ETOX™ VIII process technology (130 nm)
- Security
- — One-Time Programmable Registers:
- 64 unique factory device identifier bits
- 64 user-programmable OTP bits
- Additional 2048 user-programmable OTP bits
- — Selectable OTP Space in Main Array:
- 4x32KB parameter blocks + 3x128KB main blocks (top or bottom configuration)
- — Absolute write protection: VPP= VSS
- — Power-transition erase/program lockout
- — Individual zero-latency block locking
- — Individual block lock-down
- Software
- — 20 µs (Typ) program suspend
- — 20 µs (Typ) erase suspend
- —Intel® Flash Data Integrator optimized
- — Basic Command Set and Extended Command Set compatible
- — Common Flash Interface capable
- Density and Packaging
- — 64/128/256-Mbit densities in 56-Lead TSOP package
- — 64/128/256/512-Mbit densities in 64-Ball Intel®Easy BGA package
- — 64/128/256/512-Mbit and 1-Gbit densities in Intel®QUAD+ SCSP
- — 16-bit wide data bus
仕様
パラメータ | 価値 | パラメータ | 価値 |
---|---|---|---|
Pbfree Code | Yes | Rohs Code | Yes |
Part Life Cycle Code | Obsolete | Ihs Manufacturer | MICRON TECHNOLOGY INC |
Package Description | TSOP-56 | Reach Compliance Code | compliant |
ECCN Code | EAR99 | HTS Code | 8542.32.00.51 |
Samacsys Manufacturer | Micron | Access Time-Max | 20 ns |
Additional Feature | IT ALSO HAVE ASYNCHRONOUS OPERATING MODE | Boot Block | BOTTOM |
Command User Interface | YES | Common Flash Interface | YES |
Data Polling | NO | JESD-30 Code | R-PDSO-G56 |
JESD-609 Code | e3 | Length | 18.4 mm |
Memory Density | 268435456 bit | Memory IC Type | FLASH |
Memory Width | 16 | Number of Functions | 1 |
Number of Sectors/Size | 4,255 | Number of Terminals | 56 |
Number of Words | 16777216 words | Number of Words Code | 16000000 |
Operating Mode | SYNCHRONOUS | Operating Temperature-Max | 85 °C |
Operating Temperature-Min | -40 °C | Organization | 16MX16 |
Package Body Material | PLASTIC/EPOXY | Package Code | TSSOP |
Package Equivalence Code | TSSOP56,.8,20 | Package Shape | RECTANGULAR |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Parallel/Serial | PARALLEL |
Programming Voltage | 1.8 V | Qualification Status | Not Qualified |
Seated Height-Max | 1.025 mm | Sector Size | 16K,64K |
Standby Current-Max | 0.00021 A | Supply Current-Max | 0.031 mA |
Supply Voltage-Max (Vsup) | 2 V | Supply Voltage-Min (Vsup) | 1.7 V |
Supply Voltage-Nom (Vsup) | 1.8 V | Surface Mount | YES |
Technology | CMOS | Temperature Grade | INDUSTRIAL |
Terminal Finish | MATTE TIN | Terminal Form | GULL WING |
Terminal Pitch | 0.5 mm | Terminal Position | DUAL |
Toggle Bit | NO | Type | NOR TYPE |
Width | 14 mm |
配送
配送タイプ | 配送料 | リードタイム | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 日々 | |
フェデックス | $20.00-$40.00 (0.50 KG) | 2-5 日々 | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 日々 | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 日々 | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 日々 | |
登録された航空便 | $20.00-$40.00 (0.50 KG) | 2-5 日々 |
処理時間:送料は地域や国によって異なります。
支払い
支払条件 | ハンドフィー | |
---|---|---|
電信送金 | 銀行手数料 US$30.00 を請求します。 | |
ペイパル | 4.0%のサービス料がかかります。 | |
クレジットカード | 3.5%のサービス料がかかります。 | |
ウエスタンユニオン | charge US.00 banking fee. | |
送金サービス | 銀行手数料は 0.00 米ドルかかります。 |
保証
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2.受け取った商品の一部が完璧な品質ではない場合、当社は責任を持って返金または交換を手配します。 ただし、商品は元の状態のままでなければなりません。
パッキング
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すべての商品に問題がないことを確認した後、梱包後、安全に梱包し、グローバルエクスプレスで発送します。 優れた耐穿刺性と耐引裂性を示し、シールの完全性も良好です。
パーツポイント
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The JS28F256P30BFE is a flash memory chip manufactured by Intel. It offers 256 megabits of storage capacity and uses a parallel interface. With fast read and program speeds, it's commonly used in embedded systems, consumer electronics, and industrial applications for data storage and firmware updates.
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Equivalent
Equivalent products to the JS28F256P30BFE chip include the Intel 28F256P30B, SST28SF256P30B, and AM28F256P30BF. These chips share similar specifications and functionalities, making them suitable alternatives for various applications. -
Features
1. 256Mb NAND Flash Memory 2. 3.0V Supply Voltage 3. Extended Temperature Range: -40°C to 85°C 4. Small Form Factor: 48-ball FBGA 5. High Speed Interface: 50ns Page Access Time 6. Flexible Erase and Program Algorithms 7. Data Retention: 20 Years 8. Industry-Standard JEDEC Packaging -
Pinout
The JS28F256P30BFE is a 256-megabit (32 megabyte) flash memory chip. It has a 64-pin count. The pins serve functions such as power supply, address input/output, data input/output, and control signals for reading, writing, and erasing data. -
Manufacturer
The JS28F256P30BFE is manufactured by Intel Corporation, a leading American multinational corporation known for designing and manufacturing semiconductor chips and related products. Intel is one of the largest and most influential technology companies globally, particularly renowned for its microprocessors for personal computers. -
Application Field
The JS28F256P30BFE is commonly used in embedded systems, telecommunications equipment, networking devices, and automotive electronics for storing firmware, boot code, and data. It's suitable for applications requiring reliable, high-density, non-volatile memory with fast read and write operations. -
Package
The JS28F256P30BFE chip is a BGA package type, with a TSOP form factor, and a size of 49.21 mm x 25.61 mm.
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