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Intel EP2C70F672C8

Name: EP2C70F672C8
Brand: INTEL CORP
Rating: 4.8 (10 reviews)

ROHS Compliant EP2C70F672C8 68416 4276 FBGA-672(27x27) Programmable Logic Device

ブランド: INTEL CORP

製造元部品 #: EP2C70F672C8

データシート: EP2C70F672C8 データシート (PDF)

パッケージ/ケース: FBGA-672

RoHS ステータス:

在庫状況: 6,554 個、新しいオリジナル

製品の種類: FPGAs (Field Programmable Gate Array)

Warranty: 1 Year Ovaga Warranty - Find Out More

価格設定

*すべての価格は米ドルです

数量	単価	外部価格
1	$1408.287	$1408.287
200	$561.916	$112383.200
480	$543.139	$260706.720
1000	$533.860	$533860.000

在庫あり: 6,554 PCS

- +

簡単な見積もり

RFQを提出してください EP2C70F672C8 またはメールでご連絡ください: Eメール: [email protected], 12時間以内にご連絡させていただきます。

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述べる

EP2C70F672C8 概要

In conclusion, the EP2C70F672C8 FPGA from Intel (formerly Altera) stands as a reliable and efficient solution for complex digital designs. With its high logic element count, embedded memory, dedicated multipliers, and various I/O options, this FPGA is well-suited for a wide range of applications in telecommunications, automotive, industrial control, and more. Its support for Intel's Quartus Prime development software further enhances its usability, making it a valuable tool for engineers and designers working on advanced projects

特徴

High-density architecture with 4,608 to 68,416 LEs
M4K embedded memory blocks
Up to 1.1 Mbits of RAM available without reducing available logic
4,096 memory bits per block (4,608 bits per block including 512 parity bits)
Variable port configurations of ×1, ×2, ×4, ×8, ×9, ×16, ×18, ×32, and ×36
True dual-port (one read and one write, two reads, or two writes) operation for ×1, ×2, ×4, ×8, ×9, ×16, and ×18 modes
Byte enables for data input masking during writes
Up to 260-MHz operation
Embedded multipliers
Up to 150 18- × 18-bit multipliers are each configurable as two independent 9- × 9-bit multipliers with up to 250-MHz performance
Optional input and output registers
Advanced I/O support
High-speed differential I/O standard support, including LVDS, RSDS, mini-LVDS, LVPECL, differential HSTL, and differential SSTL
Single-ended I/O standard support, including 2.5-V and 1.8-V, SSTL class I and II, 1.8-V and 1.5-V HSTL class I and II, 3.3-V PCI and PCI-X 1.0, 3.3-, 2.5-, 1.8-, and 1.5-V LVCMOS, and 3.3-, 2.5-, and 1.8-V LVTTL
Peripheral Component Interconnect Special Interest Group (PCI SIG) PCI Local Bus Specification, Revision 3.0 compliance for 3.3-V operation at 33 or 66 MHz for 32- or 64-bit interfaces
PCI Express with an external TI PHY and an Altera PCI Express ×1 Megacore® function
133-MHz PCI-X 1.0 specification compatibility
High-speed external memory support, including DDR, DDR2, and SDR SDRAM, and QDRII SRAM supported by drop in Altera IP MegaCore functions for ease of use
Three dedicated registers per I/O element (IOE): one input register, one output register, and one output-enable register
Programmable bus-hold feature
Programmable output drive strength feature
Programmable delays from the pin to the IOE or logic array
I/O bank grouping for unique VCCIO and/or VREF bank settings
MultiVolt™ I/O standard support for 1.5-, 1.8-, 2.5-, and 3.3-interfaces
Hot-socketing operation support
Tri-state with weak pull-up on I/O pins before and during configuration
Programmable open-drain outputs
Series on-chip termination support
(Continue .)

仕様

パラメータ	価値	パラメータ	価値
Rohs Code	No	Part Life Cycle Code	Active
Ihs Manufacturer	INTEL CORP	Package Description	FBGA-672
Reach Compliance Code	compliant	HTS Code	8542.39.00.01
Additional Feature	ALSO REQUIRES 3.3 SUPPLY	Clock Frequency-Max	402.5 MHz
JESD-30 Code	S-PBGA-B672	JESD-609 Code	e0
Length	27 mm	Moisture Sensitivity Level	3
Number of CLBs	4276	Number of Inputs	422
Number of Logic Cells	68416	Number of Outputs	406
Number of Terminals	672	Operating Temperature-Max	85 °C
Operating Temperature-Min		Organization	4276 CLBS
Package Body Material	PLASTIC/EPOXY	Package Code	BGA
Package Equivalence Code	BGA672,26X26,40	Package Shape	SQUARE
Package Style	GRID ARRAY	Power Supplies	1.2,1.5/3.3,3.3 V
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	Qualification Status	Not Qualified
Seated Height-Max	2.6 mm	Supply Voltage-Max	1.25 V
Supply Voltage-Min	1.15 V	Supply Voltage-Nom	1.2 V
Surface Mount	YES	Technology	CMOS
Temperature Grade	OTHER	Terminal Finish	TIN LEAD
Terminal Form	BALL	Terminal Pitch	1 mm
Terminal Position	BOTTOM

配送

	配送料	リードタイム
DHL	$20.00-$40.00 (0.50 KG)	2-5 日々
フェデックス	$20.00-$40.00 (0.50 KG)	2-5 日々
UPS	$20.00-$40.00 (0.50 KG)	2-5 日々
TNT	$20.00-$40.00 (0.50 KG)	2-5 日々
EMS	$20.00-$40.00 (0.50 KG)	2-5 日々
登録された航空便	$20.00-$40.00 (0.50 KG)	2-5 日々

処理時間：送料は地域や国によって異なります。

支払い

支払条件		ハンドフィー
	電信送金	銀行手数料 US$30.00 を請求します。
	ペイパル	4.0％のサービス料がかかります。
	クレジットカード	3.5％のサービス料がかかります。
	ウエスタンユニオン	charge US.00 banking fee.
	送金サービス	銀行手数料は 0.00 米ドルかかります。

保証

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パーツポイント

The EP2C70F672C8 is a field-programmable gate array (FPGA) chip manufactured by Intel. It belongs to the Cyclone II family and features 70,000 logic elements, 622 user I/O pins, and 504 embedded multipliers. With its configurable nature, it's widely used in various applications such as telecommunications, industrial automation, and consumer electronics.
Equivalent

The EP2C70F672C8 chip is part of Altera's Cyclone II FPGA series. Equivalent products include Xilinx's Spartan-3, Lattice Semiconductor's MachXO2, and Microchip's SmartFusion2. Each offers similar programmable logic capabilities, though specifics may vary.
Features

The EP2C70F672C8 is an Altera Cyclone II FPGA. Its features include 70,000 logic elements, 4 Mbits of embedded memory, 266 MHz maximum core frequency, and 672 user I/O pins. It operates on a 1.2V core voltage and supports various communication protocols like PCIe and Gigabit Ethernet.
Pinout

The EP2C70F672C8 is an FPGA with 672 pins. Its functions include programmable logic, configurable I/Os, memory blocks, and DSP slices for flexible customization and high-performance computing tasks.
Manufacturer

The EP2C70F672C8 is manufactured by Altera Corporation, now part of Intel Corporation. Altera specialized in manufacturing programmable logic devices, particularly field-programmable gate arrays (FPGAs). FPGAs are integrated circuits designed to be configured by a customer or a designer after manufacturing, allowing for customizable hardware solutions in various applications like telecommunications, automotive, and industrial automation.
Application Field

The EP2C70F672C8 is commonly used in a variety of applications, including telecommunications, industrial automation, automotive, and aerospace. It is suitable for applications that require high-performance processing, reliable operation, and low power consumption. Its FPGA architecture allows for flexibility and adaptability in a range of different environments.
Package

The EP2C70F672C8 chip is a Field-Programmable Gate Array (FPGA) from Intel (formerly Altera). It comes in a Ball Grid Array (BGA) package with a form factor of 672-pin. The package size is 27mm x 27mm.